See these bumps right here? I've been looking every on google about this.

I need to solder a wire to an existing point. These existing points are these solder bumps. So I looked up google about this specific scenario and I can't find anything.

This is a video of someone that looks like he is tinning the bumps. But he did not show the part where he would wire to the bumps.

https://www.youtube.com/watch?v=EDs65aUjC-E

This post was edited by desertwolf on Mar 11 2015 11:14am

The "bump" is just a tiny bit of solder. You would solder on to it like anything else - by getting a soldering iron, and either just melting the existing solder and sinking your extra wire into it (if it's thin enough), or putting another small drop on top. Just need to make sure you don't create a bridge with any neighbours and don't damage the board by overheating it.

In the video he's sort-of tinning them. Tinning is typically putting solder on a contact that doesn't have any to begin with, while he's adding a little more so that he can later melt it with a clean iron and just sink his wire into it. You can do the same thing.

apply tin to the bump you want to solder, also apply tin to the wire you want to attach. heat up the sire as much as it needs, so it sucks the tin to its surface.
then put the wire to the desired bump and fuse the tin by heating it up shortly.

thats it